Intellectual Property India Publishes Patent Application for A Hybrid Microneedle Patch And Its Scalable Fabrication Process

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202531008648 A) filed by National Institute Of Technology Rourkela on February 03, 2025, for A Hybrid Microneedle Patch And Its Scalable Fabrication Process.

Inventors include Prasoon Kumar; Mirza Khalid Baig; Kamasani Aryasree; Pragyan Ray; and Swagatika Barik.

The application for the patent was published on August 07, 2026, under issue no. 32/2026.

Abstract: ABSTRACT A HYBRID MICRONEEDLE PATCH AND ITS SCALABLE FABRICATION PROCESS An apparatus for a scalable fabrication process to make a hybrid microneedle patch, comprising: a two-part mold design with an operative top part (10), and an operative bottom part (20),said operative bottom part consisti...