MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202511012073 A) filed by Havells India Ltd. on February 12, 2025, for A Formulation And Method For Dip Coating Of An Electrolytic Tough Pitch-Copper Joint Assembly.
Inventors include Kumar, Navdeep; and Kumar, Amit.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present invention provides a formulation for coating on an ETP-Cu (Electrolytic Tough Pitch-Cu) substrate to enhance the resistance of ETP-Cu joint assembly for successful spot welding of joint. The present invention provides a tin salt based formulation for dip coating on an ETP-Cu (Electrolytic Tough Pitch-Cu) substrate of joint ...