MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202511011510 A) filed by Birla Institute Of Technology & Science Bits, Pilani on February 11, 2025, for A Dissolvable Microneedle Patch For Trans-Scleral Delivery Of Regorafenib, And A Method Of Preparation Thereof.
Inventors include Venuganti, Venkata Vamsi Krishna; and Naik, Sharayu.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present disclosure pertains to trans-scleral delivery of an active substance in a therapeutically effective amount. In particular, the present disclosure provides an anti-vansular endothelial growth factor (anti-VEGF) drug-loaded microneedle scleral patch (MSP) ...