MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202641109357 A) filed by Agnit Semiconductors Private Limited on September 11, 2026, for A Co-Packaged Semiconductor Device For Improving Linearity Performance And A Method Thereof.
Inventors include Terirama Thingujam; Digbijoy Neelim Nath; and Hareesh Chandrasekar.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: A CO-PACKAGED SEMICONDUCTOR DEVICE FOR IMPROVING LINEARITY PERFORMANCE AND A METHOD THEREOF The present invention relates to a co-packaged semiconductor device (100) for improving linearity performance and a method (400) thereof. The co-packaged semiconductor device (100) comprises an...