MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202611023686 A) filed by Indian Institute Of Technology, New Delhi, on Feb. 27, for 'viscoelastic adhesive and method of fabrication thereof.'
Inventor(s) include Verma, Mohan Kumar Singh; Ghosh, Somnath; and Mukhopadhyay, Titir.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "A viscoelastic adhesive and method of fabrication thereof is provided. The adhesive includes an adhesive layer having a viscoelastic polymer cross-linked using a cross-linking agent. The adhesive layer involve one of a single layer, a multi-layer and a gradient layer. The adhe...