MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202617016107 A) filed by Bostik Sa, Puteaux, France, on Feb. 13, for 'two-component thermally conductive composition.'
Inventor(s) include Sanz, Federico; Holle, Sophie; Olejnik, Nicolas; Mayer, Christoph; and Stosser, Benjamin.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The invention relates to a two-component thermally conductive composition comprising: - a component A comprising: * at least one polyol P having a functionality of at least 4, and * at least one thermally conductive filler; and - a component B comprising: * at least one p...