Intellectual Property India Publishes Patent Application for 'Smart Package With Event-Based Tampering Signature And Verification' Filed by Cvr College Of Engineering

MUMBAI, India, Feb. 13 -- Intellectual Property India has published a patent application (202641007578 A) filed by Cvr College Of Engineering, Hyderabad, Telangana, on Jan. 27, for 'smart package with event-based tampering signature and verification.'

Inventor(s) include P. Vasantha Lakshmi; S. Vineela Krishna; and Avula Chitty.

The application for the patent was published on Feb. 13, under issue no. 07/2026.

According to the abstract released by the Intellectual Property India: "Smart packaging systems that can identify, categorize and establish a history of tampering events are revealed. The system includes a package enclosure coupled with one or more sensors designed to measure physical contact with the package such as forces to open ...