MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202544082221 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on Aug. 29, 2025, for 'semiconductor package.'
Inventor(s) include Junghoon Kang.
The application for the patent was published on April 10, under issue no. 15/2026.
According to the abstract released by the Intellectual Property India: "A semiconductor package includes a substrate, a logic die on the substrate, a base insulating layer on side surfaces and an upper surface of the logic die, an insulating layer through via extending through the base insulating layer at a side of the logic die, a high bandwidth memory on an upper surface of the base insulating layer, a...