MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202611027007 A) filed by Fiberise Fit Pvt. Ltd., New Delhi, on March 7, for 'protein- and fiber-enriched wheat flour composition for flatbread preparation and method for preparation thereof.'
Inventor(s) include Diwakar Vaish; and Sakshi Dhall.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "The present invention discloses a protein- and fiber-enriched wheat flour composition for preparation of flatbread products such as chapatis, rotis, tortillas, and similar unleavened breads. The composition comprises whole wheat flour, yeast-derived protein, vit...