MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514066021 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on July 10, 2025, for 'photoelectric packaging structure, manufacturing method thereof, and camera module.'
Inventor(s) include Hung-Ta Li; Hsin-Yen Hsu; Yi-Mou Huang; and Tzu-Li Feng.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A photoelectric packaging structure, manufacturing method, and camera module are provided. The structure includes a substrate module, a photosensitive chip, and a cover module. The substrate module includes a packaging body and a f...