MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514066018 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on July 10, 2025, for 'photoelectric packaging structure, manufacturing method, and camera module.'
Inventor(s) include Hung-Ta Li; Hsin-Yen Hsu; Tzu-Li Feng; and Yi-Mou Huang.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A photoelectric packaging structure, manufacturing method, and camera module are provided. The structure includes a substrate module, a photosensitive chip, and a plastic packaging module. The substrate module includes a glass substrate an...