Intellectual Property India Publishes Patent Application for 'Molded Core Substrate For Embedding Components' Filed by Advanced Micro Devices, Inc.

MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202647040971 A) filed by Advanced Micro Devices, Inc., Santa Clara, U.S.A., on March 31, for 'molded core substrate for embedding components.'

Inventor(s) include Kulkarni, Deepak Vasant; Boyapati, Sri Ranga Sai; and Sidhu, Rajen Singh.

The application for the patent was published on April 10, under issue no. 15/2026.

According to the abstract released by the Intellectual Property India: "Active and passive electronic components are placed on a substrate and encapsulated with mold material to produce a molded core substrate for fabricating a hybrid integrated circuit (IC) device. A carrier has a release film laminated to a face thereof. A seed laye...