Intellectual Property India Publishes Patent Application for 'Low-Carbon Composite Thermal Insulation Tile For Energy-Efficient Building Applications' Filed by Sri Krishna College Of Engineering And Technology

MUMBAI, India, Feb. 27 -- Intellectual Property India has published a patent application (202641019058 A) filed by Sri Krishna College Of Engineering And Technology, Coimbatore, Tamil Nadu, on Feb. 19, for 'low-carbon composite thermal insulation tile for energy-efficient building applications.'

Inventor(s) include Sakthivel R; Gokul Sibi M; Manikandan T; Rufus Boban; and Surendar D.

The application for the patent was published on Feb. 27, under issue no. 09/2026.

According to the abstract released by the Intellectual Property India: "The present invention discloses a sustainable thermal insulation tile comprising a unique composite of low-carbon and waste-derived materials. The tile includes a binder system of lime, Ground Granulated Bl...