Intellectual Property India Publishes Patent Application for 'Fabrication Of Copper-Coated Lightweight Materials For Advanced Electrical And Heat Transfer Applications' Filed by National Institute Of Technology

MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202641045801 A) filed by National Institute Of Technology, Mangaluru, Karnataka, on April 9, for 'fabrication of copper-coated lightweight materials for advanced electrical and heat transfer applications.'

Inventor(s) include Rajasekaran Balasundaram; and Sreerag M P.

The application for the patent was published on May 1, under issue no. 18/2026.

According to the abstract released by the Intellectual Property India: "Fabrication of Copper-Coated Lightweight Materials for Advanced Electrical and Heat Transfer Applications A process for fabricating copper-coated lightweight materials for advanced electrical and heat transfer applications using HVAF proc...