Intellectual Property India Publishes Patent Application for 'Dual-Conductive Porous Interlayer Architecture Using Carbon-Coated Fibrous Substrates For Enhanced Ion-electron Transport In Multilayer Electrochemical Devices' Filed by Sr University

MUMBAI, India, April 17 -- Intellectual Property India has published a patent application (202641042391 A) filed by Sr University, Warangal, Telangana, on April 2, for 'dual-conductive porous interlayer architecture using carbon-coated fibrous substrates for enhanced ion-electron transport in multilayer electrochemical devices.'

Inventor(s) include Dr. Manoranjan Ojha.

The application for the patent was published on April 17, under issue no. 16/2026.

According to the abstract released by the Intellectual Property India: "The present invention discloses a novel multilayer device architecture incorporating a dual-conductive porous interlayer composed of carbon-coated fibrous substrates, such as cellulose-based filter paper. The interlayer ...