Intellectual Property India Publishes Patent Application for 'Cooling Arrangement For An Electronic Assembly' Filed by Motorama Ev Private Limited

MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202611007387 A) filed by Motorama Ev Private Limited, Noida, Uttar Pradesh, on Jan. 25, for 'cooling arrangement for an electronic assembly.'

Inventor(s) include Abhishek Gupta.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "Disclosed is a cooling arrangement for an electronic assembly, comprising an electronic substrate comprising an upper surface on which at least one heat-generating electronic component is mounted and a lower surface opposite the upper surface, a cooling plate disposed adjacent to the lower surface of the electronic substr...