Intellectual Property India Publishes Patent Application for 'Communication Method And Apparatus, Chip, Chip Module, And Storage Medium' Filed by Honor Device Co. Ltd.

MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202637047386 A) filed by Honor Device Co. Ltd., Guangdong, China, on April 14, for 'communication method and apparatus, chip, chip module, and storage medium.'

Inventor(s) include Zhang, Mingzhu; and Shan, Baokun.

The application for the patent was published on April 17, under issue no. 16/2026.

According to the abstract released by the Intellectual Property India: "A communication method and apparatus, a chip, a chip module, and a storage medium. When a first timer times out, does not run or is not configured and there is no resource for a delay status report, a scheduling request is triggered, wherein one or more duration values of the first time...