MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202641049549 A) filed by J. B. Institute Of Engineering And Technology, Hyderabad, Telangana, on April 18, for 'an ai-driven intelligent system for integrated structural and thermal behavior modeling of advanced materials.'

Inventor(s) include Dr. K. Venkatesham; Mr. Venkat Reddy Julakanti; Ms. K. Vaishnavi; Ms. B. Poojitha; Mrs. S. Swetha; and Mr. M. Naveen Kumar.

The application for the patent was published on May 1, under issue no. 18/2026.

According to the abstract released by the Intellectual Property India: "The present invention discloses an AI-driven intelligent system for integrated modeling and predictive analysis of structural and thermal b...