MUMBAI, India, Feb. 6 -- Intellectual Property India has published a patent application (202631008076 A) filed by National Institute Of Technology, Silchar, Assam, on Jan. 27, for 'a method for manufacturing eco-friendly fused deposition modelling filament from printed circuit board waste.'
Inventor(s) include Neog, Debaraj; Sharma, Vikas; Neog, Ankur Jyoti; Nath, Kaushik Ranjan; Deoghare, Ashish Bhalchandra; and Mahmun, Amdadul.
The application for the patent was published on Feb. 6, under issue no. 06/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a method for manufacturing eco-friendly fused deposition modelling filament from printed circuit board waste. The development o...