Intellectual Property India Publishes Patent Application for 'A Hybrid Structural Assembly' Filed by Indian Institute Of Technology

MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202611009869 A) filed by Indian Institute Of Technology, New Delhi, on Jan. 30, for 'a hybrid structural assembly.'

Inventor(s) include Banerjee, Arnab; and Kumar, Sundeep.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "The disclosed structural assembly (100) includes a first rigid member (102), a second structural member (104), and at least one one pneumatic tension element (106). The second structural member (104) is arranged spaced apart from the first structural member (102). The pneumatic tension element is positioned between the first s...