Intellectual Property India Publishes Patent Application for 'A Copper Plate Thermal Management Device With Semicircular Microchannels' Filed by National Institute Of Technology

MUMBAI, India, Feb. 27 -- Intellectual Property India has published a patent application (202631015047 A) filed by National Institute Of Technology, Patna, Bihar, on Feb. 11, for 'a copper plate thermal management device with semicircular microchannels.'

Inventor(s) include Anand Kumar; and Om Prakash.

The application for the patent was published on Feb. 27, under issue no. 09/2026.

According to the abstract released by the Intellectual Property India: "The present invention pertains to a copper plate thermal management device (10) for efficient cooling of electronic components. The device comprises a copper base plate (1) configured to receive heat from an electronic component mounted thereon. A plurality of parallel microchannels (2) a...