Intellectual Property India Publishes Patent Application for “heat Sink Structure And Semiconductor Package Combined With The Heat Sink”

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202514106135 A) filed by Jmj Korea Co. , Ltd. on November 03, 2025, for “heat Sink Structure And Semiconductor Package Combined With The Heat Sink”.

Inventors include Choi, Yunhwa; Choi, Jeongwoo; and Lee, Junho --.

The application for the patent was published on August 28, 2026, under issue no. 35/2026.

Abstract: ABSTRACT HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE COMBINED WITH THE HEAT SINK Provided is a heat sink structure and a semiconductor package combined with the heat sink, and more particularly, to a heat sink structure having an improved structure to efficiently release heat generated from a semiconductor package through various surface...