India, July 25 -- Samsung Electronics and Broadcom on Saturday announced the signing of a memorandum of understanding (MoU) to significantly expand their strategic collaboration across memory and foundry technologies, aiming to accelerate the development of next-generation artificial intelligence (AI) infrastructure.

The announcement was made during the AI Summit at The Midway in San Francisco. The event was attended by Jinman Han, President and Head of Samsung Electronics' Foundry Business; Hock Tan, President and CEO of Broadcom; senior executives from both companies; and representatives of the South Korean government.

Under the agreement, the two companies expect their collaboration to exceed $200 billion across memory and foundry bu...