India, May 29 -- A Memorandum of Understanding (MoU) has been signed between the Government of Odisha, Intel Corporation and 3DGS Inc., USA, to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in the state.

With an estimated investment of nearly USD 3.3 billion, the project is being seen as one of the largest high-technology manufacturing investments in India. The proposed facility will be located in the Bhubaneswar-Khurda region, according to a government statement.

Union Minister for Electronics and Information Technology Ashwini Vaishnaw said the landmark MoU aligns with the Government of India's vision of developing a complete semiconductor manufacturing ecosystem in the country.

He noted that the entry o...