India, April 18 -- Odisha is set to take a major leap toward becoming a global hub for advanced semiconductor manufacturing, with the groundbreaking ceremony of India's first Advanced 3D Glass Semiconductor Packaging Unit scheduled for April 19, 2026, in Bhubaneswar.

With an estimated investment of Rs.1,943 crore, the facility will have an annual production capacity of 50 million assembled units and is expected to generate around 2,500 direct and indirect jobs.

The unit is backed by major global technology players, including Intel, Lockheed Martin, and Applied Materials. The chips produced will cater to critical sectors such as aerospace, defence, artificial intelligence, and 5G technologies.

With this development, Odisha becomes the f...