India, April 20 -- India moved a step closer to ending its dependence on imported chip packaging technology on Sunday, with Odisha Chief Minister Mohan Majhi laying the foundation stone for the country's first glass substrate-based advanced chip packaging unit in Bhubaneswar that promises to bring cutting-edge semiconductor packaging capability onshore for critical sectors ranging from artificial intelligence to defence.

The facility, being set up by US-based 3D Glass Solutions Inc. (3DGS) at Info Valley in Bhubaneswar, entails an investment of approximately Rs.1,943 crore and will deploy advanced 3D heterogeneous integration (3DHI) packaging technology which India has so far relied on imports to access.

Union Electronics and IT Ministe...