LUCKNOW, April 9 -- Dr APJ Abdul Kalam Technical University (AKTU) has joined forces with Siemens EDA, an electronic design automation software company, to equip engineering students with semiconductor expertise. The Memorandum of Understanding (MoU) signed on Thursday will extend software training to 300 colleges across the state, supporting India's semiconductor mission.

Through its corporate social responsibility (CSR) funds, Siemens will provide seven design software packages to the university, including Design Verification Bond, IC Nanometer Design Bond, PCB Design Bundle, Questa Advanced Formal Bond, Valour PCB Design Verif Bond, Aprisa P R Platform Bond, as well as 3D IC Design Bond. Software subscriptions will extend to affiliate...