India, Nov. 10 -- India's semiconductor manufacturing plans are gaining another layer of capability, this time in advanced packaging. Paras Semiconductors, a subsidiary of Paras Defence & Space Technologies, has partnered with US-based BroadPak Corporation to develop an outsourced semiconductor assembly and test (OSAT) facility in India. The proposed facility will focus on 2.5D and 3D packaging, chiplet integration and other advanced technologies.

The Paras Semiconductors and BroadPak partnership is significant because it looks beyond conventional chip manufacturing. It aims to build capabilities that bring multiple semiconductor components together within a single package, supporting applications that need higher computing performance, ...