India, March 5 -- Global semiconductor leaders, researchers and policymakers gathered at the first International Electronics, Packaging, Design & Manufacturing Conference (EPDMC 2026) to discuss the evolving semiconductor landscape and the projected expansion of the integrated circuit industry over the next decade.

The three-day conference, hosted by the Manav Rachna International Institute of Research and Studies (MRIIRS) in Faridabad, brought together participants from academia, industry and the startup ecosystem. Organised under the IEEE Electronics Packaging Society in collaboration with the IEEE EPS Delhi Chapter, the event focused on the theme "Bridging Skills and Innovation for India's Industry."

Discussions during the conference...