India, May 21 -- The AI boom is no longer just about building faster chips. It is now becoming a race to connect chips smarter, faster, and more efficiently. That is where the Applied Materials Broadcom EPIC partnership is trying to make an impact.

Applied Materials announced that Broadcom will join its EPIC platform as an innovation partner to accelerate the development of advanced packaging AI chips for next-generation AI infrastructure. The move reflects a wider shift happening across the semiconductor industry, where chipmakers are increasingly focusing on heterogeneous integration in semiconductor design to improve performance-per-watt and speed up AI workloads.

As AI models become larger and more power-hungry, traditional chip sca...