India, May 29 -- In a significant boost to India's semiconductor ambitions, the Government of Odisha, Intel Corporation and 3DGS Inc. (USA) have signed a Memorandum of Understanding (MoU) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha.
The proposed project, with an estimated investment of around USD 3.3 billion, is among the largest high-technology manufacturing investments announced in India. The facility is planned to be set up in the Bhubaneswar-Khurda region and will be developed in phases over the next five to six years.
The facility will focus on manufacturing advanced packaging glass core substrates, high-density interconnect substrates and related semiconductor technologies. Intel will pro...