Vertical Semiconductor signs LoI with U.S. DoC for $73 million in CHIPS funding to accelerate R&D of vertical GaN power transistors
India, Oct. 30 -- Vertical Semiconductor, a power semiconductor company, today announced it has signed a letter of intent with the U.S. Department of Commerce's CHIPS Research and Development Office (CRDO) to receive up to $73 million in federal incentives under the CHIPS and Science Act.
The proposed incentives are expected to accelerate research and development of next-generation vertical gallium nitride (GaN) power transistors, unlock domestic production of this technology, and strengthen U.S. leadership in power infrastructure for artificial intelligence (AI) and high-performance computing.
Spun out of MIT, Vertical Semiconductor is developing vertical GaN FinFET technology that drives extreme efficiency and power density in power s...
Click here to read full article from source
To read the full article or to get the complete feed from this publication, please
Contact Us.