India, Aug. 17 -- Amid surging demand for advanced packaging, TSMC VP of Advanced Packaging Technology and Services Jun He highlighted the company's latest CoWoS advances at the 2026 OCP APAC Summit.

According to TechNews and the Economic Daily News, TSMC's 5.5-reticle-size CoWoS is now in volume production, with yields consistently topping 98% across multiple AI customer products and reaching as high as 99% in some cases.

TSMC is already mapping out its next leap. He said the company expects CoWoS to scale beyond 14x reticle size by 2029, echoing the roadmap TSMC unveiled at its 2026 North America Technology Symposium. TSMC said at the forum that a 14-reticle-size CoWoS package, capable of integrating around 10 large compute dies and 2...