India, Aug. 3 -- With big techs led by NVIDIA betting on TSMC's CoWoS, the foundry giant is moving ahead with its CoPoS, or, chip-on-panel-on-substrate technology, amid strong AI demand. According to MoneyDJ and the Economic Daily News, TSMC's first CoPoS pilot line is set for 2026, with mass production targeted by 2029.

MoneyDJ highlights NVIDIA as the likely first big customer for TSMC's CoPoS, while Economic Daily News points out that CoPoS-built for high-end applications like AI-extends CoWoS-R for Broadcom and CoWoS-L for NVIDIA and AMD.

According to the reports, TSMC's CoPoS is essentially a square-panel evolution of CoWoS-L and CoWoS-R, swapping the traditional round wafer for a rectangular substrate. Measuring 310x310mm, the rec...