India, Aug. 7 -- TSMC is broadening its advanced packaging outsourcing. According to ETNews, sources say the company has decided to expand outsourcing of CoW (Chip-on-Wafer), a key step in its CoWoS packaging technology for AI chips, to OSAT companies including ASE.

Unlike its previous practice of primarily outsourcing WoS (Wafer-on-Substrate), the latest move is intended to boost production capacity with key OSAT partners and help relieve packaging bottlenecks.

As the report explains, CoW (Chip-on-Wafer) refers to the process of attaching the chip to the interposer, while WoS (Wafer-on-Substrate) involves bonding the interposer to the main substrate.

OSAT companies, including ASE, Amkor, and SPIL have long manufactured WoS packages un...