India, July 10 -- TSMC's push into silicon photonics is drawing growing market attention, with wafer capacity for PIC (Photonic Integrated Circuits ) expected to expand significantly.

According to Commercial Times, institutional investors estimate that TSMC's PIC capacity will increase from around 500 wafers per month to 10,000 wafers by the second quarter of 2026, rise further to 15,000 wafers by the fourth quarter, and reach at least 25,000 wafers per month by 2028.

As the report highlights, given limited PIC production capacity during the initial ramp, the primary customers for volume production on TSMC's COUPE platform in 2026-2027 are likely to be NVIDIA, Broadcom, and AMD. As capacity expands further in 2028, CPO projects from cus...