TSMC and Amkor announce long-term partnership to accelerate advanced packaging in USA
India, June 18 -- Taiwan Semiconductor Manufacturing Co. (TSMC)and Amkor Technology Inc. (Nasdaq: AMKR) have announced a 10-year agreement to foster a strong partnership that will enhance advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model, while strengthening their ability to support customers' evolving requirements.
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