India, July 29 -- Tessolve, a leading global provider of semiconductor systems and silicon solutions for next-generation products, has collaborated with Intel Foundry to support package designs with Embedded Multi-die Interconnect Bridge (EMIB), an advanced packaging technology essential for heterogeneous integrated multi-chip(let) architectures.

This collaboration enables Tessolve to support Intel Foundry customers globally. Tessolve has collaborated with Intel Foundry, supporting package design and completing a project end-to-end, which includes package design and simulations. This allowed Tessolve to not only gain knowledge of the technology but also helped accelerate the qualification process.

"Over the past two decades, Tessolve ha...