India, Aug. 21 -- Teledyne HiRel Semiconductors announced the release of industrial-grade embedded MultiMediaCard (eMMC) module. Featuring 128GB of eMMC 5.1-compliant storage in a compact 153-ball FBGA package, this device is engineered to deliver reliable, high-speed performance in harsh environments.

Qualified over the industrial temperature range of -40degreeC to +85degreeC, this eMMC module is well-suited for embedded applications in aerospace, defense, industrial automation, and ruggedized edge computing. Its integrated controller handles wear leveling, bad block management, and error correction (ECC), ensuring long-term data integrity and simplified system integration.

"With eMMC continuing to serve as a foundational technology fo...