India, Aug. 12 -- Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from -40degreeC to +105degreeC.

The TDD416Y12NEPBM01, is a compact, solder-down DDR4-3200 memory solution that delivers high bandwidth in a dramatically reduced footprint - smaller than a postage stamp. Packaged in a 216-ball BGA measuring just 22mm x 22mm, it is engineered for systems where board space is limited and performance is critical.

Its streamlined design integrates memory, termination, and passives into a single unified 22mm2 module - effectively replacing ...