India, Oct. 27 -- Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with Nvidia.

The latest updates combine the self-verifying agentic AI capabilities introduced at DAC 2026 with accelerated computing to address one of advanced packaging's most demanding hurdles: electrical, power, thermal and codesign for 3D ICs.

The new capability orchestrates Siemens' electrothermal analysis portfolio into a single autonomous workflow. By leveraging Siemens' Design Space Exploration and Optimization (DSE/DSO) technology, the workflow allows engineers to evaluate and validate hundreds of design alternatives against signoff-grade, physics-based solvers.

In benchmark studies, this approach reduced engineering e...