India, May 1 -- Since April 2026, global semiconductor packaging and testing sector has seen a wave of major developments. ASE has kicked off its largest-ever fab construction program, with six new facilities slated to break ground worldwide this year.

Meanwhile, Samsung Electronics plans to invest USD 4 billion in a new packaging and testing plant in Vietnam, while Amkor is simultaneously accelerating its capacity expansion in the country.

ASE expands production globally

On April 10, 2026, ASE Technology Holding held a groundbreaking ceremony for a new facility in Kaohsiung's Renwu Industrial Park. With total investment exceeding TWD 108.3 billion, the plant will focus on advanced semiconductor testing services, covering applications ...