India, April 1 -- Rising semiconductor foundry and outsourced semiconductor assembly and test (OSAT) costs since 2025, along with continued increases in precious metal prices, are placing growing cost pressure on display driver IC (DDIC) suppliers, according to the latest research from TrendForce.

In response, some vendors have recently begun discussions with panel makers to evaluate the possibility of adjusting DDIC pricing.

Breaking down cost structures reveals that foundry services account for roughly 60-70% of total DDIC costs, while backend packaging and testing typically represent around 20%.

Recent rises in raw materials, energy, and labor costs have led to higher prices in the foundry industry. Specifically, 8-inch wafer capaci...