India, Nov. 17 -- Yole Group released its latest technology and market report, Polymeric Materials for Advanced Packaging 2025, offering a deep dive into the role of polymers as critical enablers of next-generation semiconductor packaging.

Yole Group's Polymeric Materials for Advanced Packaging 2025 report delivers a comprehensive analysis of polymeric materials applications and benefits across advanced packaging platforms. The scope of the report includes dielectrics, mold compounds, underfill, and temporary bonding materials.

It details a technical roadmap that tracks the development of materials for rapidly expanding technologies like CoWoS, PLP, and HBM, as well as other fan-out, WLCSP, SiP, flip-chip, and 2.5D and 3D packaging plat...