Paras Defence enters semiconductor packaging with Rs.6,200 crore plan in MP
India, July 26 -- In a major development for India's domestic electronics manufacturing ecosystem, Paras Semiconductors Pvt Ltd - a subsidiary of defence engineering firm Paras Defence and Space Technologies - has announced plans to construct a greenfield semiconductor facility in Madhya Pradesh.
The company formalised the Rs.6,200 crore investment through a Memorandum of Understanding (MoU) signed with the Department of Science and Technology, operating via the MP State Electronics Development Corp. (MPSeDC).
Located within the strategically positioned Indore-Ujjain industrial region, the upcoming Outsourced Semiconductor Assembly and Test (OSAT) facility will focus on next-generation integrated circuit (IC) packaging technologies. The...
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