India, Aug. 26 -- OKI has successfully developed tiling crystal film bonding (CFB) technology using its proprietary CFB technology.

This technology makes possible the heterogeneous integration of small-diameter optical semiconductor wafers onto 300 mm silicon wafers, heretofore not possible due to wafer size restrictions.

This will contribute to the advancement of rapidly growing photonics-electronics convergence technology. OKI aims to achieve early commercialization through collaboration with partner companies and universities.

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