India, Sept. 17 -- LightSpeed Photonics will showcase its photonics and optical interconnect technologies live in India for the first time at SEMICON India 2026, running from September 17-19.

The demonstrations will highlight the company's advances in near- and co-packaged optics and optical interconnects aimed at AI infrastructure and next-generation data-centre networking.

Among the key demonstrations is what the company describes as the world's first solderable Near-Packaged Optics (NPO) / Co-Packaged Optics (CPO) component, capable of transferring 400 Gbps at less than 2W of power in a compact 9 mm x 9 mm footprint.

LightSpeed Photonics will also demonstrate its PCIe-over-fiber technology, which makes it possible to move compute, s...