India, Nov. 7 -- Training and deploying large AI models requires unprecedented computing power, memory bandwidth, and energy efficiency. Meeting those demands is no longer just about scaling transistors. Increasingly, it is about how chips are designed, connected, packaged, and manufactured as complete systems.

The industry's answer is taking shape in three dimensions.

3D integration, advanced packaging, next-generation memory architectures, and new patterning technologies are emerging as critical enablers of AI computing. Together, they allow chipmakers to break through traditional scaling constraints and deliver the performance gains required for the AI era.

In this context, Lam has extended its long-standing strategic collaboration ...