India, July 3 -- Advanced semiconductor packaging has become a central technology platform for high-performance computing. For AI and HPC processors, performance depends not only on transistor density, but also on memory bandwidth, I/O density, power delivery, thermal management, and the ability to integrate more functional dies within a single package. This is driving the continued adoption of 2.5D and 3D packaging architectures.

In 2.5D packaging, chiplets are integrated side by side on an interposer/redistribution platform. In 3D packaging, active dies are stacked vertically using technologies such as hybrid bonding. Together, these approaches enable heterogeneous integration across different chiplets, bring memory closer to compute, ...