India, Aug. 7 -- As AI demands unprecedented "brain power," the semiconductor industry is moving past the era of relying on single, massive chips. Advanced packaging is the essential craft of interconnecting multiple specialized chips together. This allows them to function as a single, powerful unit that runs faster handling the massive workloads of the future.

Intel's been doing advanced chip packaging for years in the U.S. and across the globe. It's one of the most crucial parts of creating multi-chip packages for today's technology products.

U.S. advanced packaging: Intel's New Mexico facilities

Inside Intel's Rio Rancho, New Mexico facilities, advanced packaging technologies are expanding the "reticle limit"-scaling packages to 8x ...